Uzbekistan and Malaysia agree to establish a semiconductor joint venture
Tashkent, Uzbekistan (UzDaily.com) — Uzbekistan and Malaysia have reached an agreement to establish a joint venture in the semiconductor industry, according to the Dunyo news agency.
During his visit to the National Applied Research and Development Center (MIMOS) of the Malaysian government, Uzbekistan’s Ambassador Karomiddin Gadoev held negotiations with Mimos Berhad CEO Saat Shukri Embong.
The discussions focused on bilateral cooperation in the semiconductor industry, including plans to create an outsourcing hub in Uzbekistan for assembly and testing of semiconductors. Additionally, the two sides explored the establishment of a Uzbek-Malaysian microelectronics technology park, which will integrate education, research, and experimental development.
The Malaysian side emphasized the importance of workforce training for the semiconductor sector, highlighting Uzbekistan’s potential for identifying and educating talented specialists. MIMOS’ infrastructure will be utilized for training, and a semiconductor production joint venture will be created with the involvement of experts from both countries.
As a result of the negotiations, an agreement was reached to establish a joint venture and a specialized academy in Uzbekistan with the participation of MIMOS and the UzEltechSanoat Association. The academy’s primary goal will be to train and upskill professionals in semiconductor technologies.
Mimos Berhad’s CEO announced that a company delegation will visit Uzbekistan in the coming months to further assess the feasibility of the planned initiatives.
Mimos Berhad, founded on 17 October 1984, as the Malaysian Microelectronic Systems Institute, initially operated under the Prime Minister’s Department before moving under the Ministry of Science, Technology, and Innovation. The center specializes in developing innovative technologies to drive socio-economic progress, as well as conducting research in semiconductors, microelectronics, and their practical applications.